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Semiconductor Wafer Grinding Machine

A precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. This machine qualifies under tariff item 8479.82.00 as grinding equipment for semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFreeβ€”Free
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡ΊπŸ‡ΈUnited StatesFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

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Import Tips & Compliance

β€’ Ensure the machine is for wafer grinding, not for general metalworking

β€’ Verify that it meets cleanroom standards if required

β€’ Provide documentation on its use in semiconductor fabrication to CBSA

Related Products under Tariff item 8479.82.00

Chemical Powder Blender

A ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation, ensuring consistent batch composition. This machine falls under tariff item 8479.82.00 as a mixing and homogenizing machine for industrial chemical processing.

Crystal Boule Grinder

A machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. This machine falls under tariff item 8479.82.00 as grinding apparatus for semiconductor processing.

Crystal Boule Melt Stirrer

A magnetic or mechanical stirrer for semiconductor melt crucibles, ensuring dopant uniformity during crystal growth and preventing striations in finished silicon ingots. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor processing.

Crystal Orientation Grinder

A grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. This machine falls under tariff item 8479.82.00 as an essential wafer preparation step for semiconductor manufacturing.

Czochralski Crystal Puller

A Czochralski Crystal Puller is a specialized machine used in semiconductor manufacturing to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon. It operates by heating and controlled mechanical lifting, which falls under the mixing, stirring, and related mechanical functions of tariff item 8479.82.00. This equipment is essential for producing high-purity silicon crystals used in electronic components.

Diamond Wafer Polishing System

A Diamond Wafer Polishing System is a chemical mechanical polishing (CMP) system using diamond abrasives to achieve a mirror finish on semiconductor wafers for device fabrication. It combines mechanical polishing with chemical slurries, falling under the grinding and polishing functions of tariff item 8479.82.00. This system is crucial for producing the ultra-smooth surfaces required in advanced microelectronics.