Semiconductor Wafer Grinding Machine from China
A precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. This machine qualifies under tariff item 8479.82.00 as grinding equipment for semiconductor processing.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the machine is for wafer grinding, not for general metalworking
• Verify that it meets cleanroom standards if required
• Provide documentation on its use in semiconductor fabrication to CBSA