Diamond Wafer Polishing System
A Diamond Wafer Polishing System is a chemical mechanical polishing (CMP) system using diamond abrasives to achieve a mirror finish on semiconductor wafers for device fabrication. It combines mechanical polishing with chemical slurries, falling under the grinding and polishing functions of tariff item 8479.82.00. This system is crucial for producing the ultra-smooth surfaces required in advanced microelectronics.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the system is used solely or principally for semiconductor wafer manufacturing
Machines for semiconductor manufacture are classified under heading 84.86, which is more specific.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document the polishing and grinding functions to support classification under 8479.82.00
• Verify if the system is used in semiconductor manufacturing, which may require classification under 8486
• Check for any environmental regulations regarding the use of chemical slurries
Related Products under Tariff item 8479.82.00
Chemical Powder Blender
A ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation, ensuring consistent batch composition. This machine falls under tariff item 8479.82.00 as a mixing and homogenizing machine for industrial chemical processing.
Crystal Boule Grinder
A machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. This machine falls under tariff item 8479.82.00 as grinding apparatus for semiconductor processing.
Crystal Boule Melt Stirrer
A magnetic or mechanical stirrer for semiconductor melt crucibles, ensuring dopant uniformity during crystal growth and preventing striations in finished silicon ingots. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor processing.
Crystal Orientation Grinder
A grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. This machine falls under tariff item 8479.82.00 as an essential wafer preparation step for semiconductor manufacturing.
Czochralski Crystal Puller
A Czochralski Crystal Puller is a specialized machine used in semiconductor manufacturing to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon. It operates by heating and controlled mechanical lifting, which falls under the mixing, stirring, and related mechanical functions of tariff item 8479.82.00. This equipment is essential for producing high-purity silicon crystals used in electronic components.
Double-Sided Wafer Lapper
A simultaneous double-sided lapping machine for semiconductor wafers, achieving uniform thickness across the entire wafer surface. This machine falls under tariff item 8479.82.00 as specialized grinding and lapping equipment for semiconductor processing.