Semiconductor Wafer Lapping Machine
A machine that laps semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. This machine falls under tariff item 8479.82.00 as specialized wafer preparation grinding equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
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Import Tips & Compliance
• Classify the lapping machine as a grinding machine for semiconductor use
• Ensure it is not a general-purpose machine tool
• Provide technical documentation on its precision for CBSA review
Related Products under Tariff item 8479.82.00
Chemical Powder Blender
A ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation, ensuring consistent batch composition. This machine falls under tariff item 8479.82.00 as a mixing and homogenizing machine for industrial chemical processing.
Crystal Boule Grinder
A machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. This machine falls under tariff item 8479.82.00 as grinding apparatus for semiconductor processing.
Crystal Boule Melt Stirrer
A magnetic or mechanical stirrer for semiconductor melt crucibles, ensuring dopant uniformity during crystal growth and preventing striations in finished silicon ingots. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor processing.
Crystal Orientation Grinder
A grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. This machine falls under tariff item 8479.82.00 as an essential wafer preparation step for semiconductor manufacturing.
Double-Sided Wafer Lapper
A simultaneous double-sided lapping machine for semiconductor wafers, achieving uniform thickness across the entire wafer surface. This machine falls under tariff item 8479.82.00 as specialized grinding and lapping equipment for semiconductor processing.
Epitaxial Gas Premix Kneader
A kneading machine for multi-component precursor gas mixtures used in epitaxial layer growth on semiconductor wafers, ensuring stoichiometric uniformity. This machine falls under tariff item 8479.82.00 as a kneading machine for semiconductor processing.