Semiconductor Wafer Lapping Machine from Germany
A machine that laps semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. This machine falls under tariff item 8479.82.00 as specialized wafer preparation grinding equipment.
Duty Rate — Germany → Canada
0%
Import Tips
• Classify the lapping machine as a grinding machine for semiconductor use
• Ensure it is not a general-purpose machine tool
• Provide technical documentation on its precision for CBSA review