Wafer Lapping Machine from Germany
A Wafer Lapping Machine is precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. This process involves grinding and mechanical action, which aligns with the functions described in tariff item 8479.82.00. It is essential for preparing wafers with the required surface quality for semiconductor fabrication.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the lapping machine is classified under 8479.82.00 by providing evidence of its grinding and abrading functions
• Check if the equipment qualifies for duty-free treatment under certain trade agreements
• Prepare to provide technical specifications to the CBSA for verification