Wafer Slicing Diamond Saw Blade
A wafer slicing diamond saw blade is a high-precision diamond-impregnated blade designed exclusively for slicing semiconductor boules into thin wafers in wafer preparation equipment. It ensures precise cuts with minimal damage, critical for wafer yield. This blade is equally suitable for use with machines of headings 84.70 to 84.72, supporting wafer preparation for ADP systems.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the blade is presented as an interchangeable tool with a working part of diamond
Circular saw blades with working parts of diamond are classified under heading 82.02 when not identifiable as machine parts.
If the blade is solely or principally used in machines for manufacturing semiconductors
Parts of machines for the manufacture of semiconductor devices are classified under heading 84.86.
If the blade is a part of a machine-tool of heading 84.56 to 84.65
Parts and accessories for machine-tools are classified under heading 84.66 when suitable for use with those machines.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the saw blade is declared as a part of semiconductor processing equipment, not as an interchangeable tool of Chapter 82
• Provide evidence of its exclusive use in wafer slicing machines
• Check if the blade qualifies for duty relief under Canada's programs for semiconductor manufacturing equipment
Related Products under Tariff item 8473.50.90
Boule Flattening Grinder Wheel
A boule flattening grinder wheel is a diamond-impregnated wheel used to grind flats on semiconductor crystal boules, indicating resistivity and conductivity type. It is designed for use with crystal preparation equipment that processes semiconductor materials for later fabrication. This wheel is equally suitable for use with machines of headings 84.70 to 84.72, as it supports the preparation of components for ADP systems.
Crystal Boule Grinder Spindle Assembly
A crystal boule grinder spindle assembly is a rotating spindle unit used in crystal grinders to shape semiconductor boules to exact wafer diameters and grind orientation flats. It is a critical component of semiconductor processing machines that prepare materials for ADP systems. This assembly is equally suitable for use with machines of headings 84.70 to 84.72, supporting various wafer preparation functions.
Crystal Growth Crucible Holder
A crystal growth crucible holder is a high-temperature-resistant holder designed to secure quartz crucibles in Czochralski silicon crystal pullers. It maintains crucible alignment and temperature stability during the crystal growth process, which is essential for producing semiconductor-grade silicon. This holder is equally suitable for use with machines of headings 84.70 to 84.72, as it supports the preparation of components for ADP systems.
Czochralski Crystal Puller Mechanism
A Czochralski crystal puller mechanism is a precision-engineered pulling mechanism used in crystal growers to produce monocrystalline silicon boules for semiconductor wafers. It is a key part of semiconductor manufacturing equipment that prepares materials for ADP systems. This mechanism is equally suitable for use with machines of headings 84.70 to 84.72, supporting various crystal growth functions.
Float Zone Crystal Furnace RF Coil
A float zone crystal furnace RF coil is a radio frequency induction coil used in float zone crystal growth furnaces to melt and purify semiconductor material without crucibles. It enables precise heating and zone refining, essential for producing high-purity silicon. This coil is equally suitable for use with machines of headings 84.70 to 84.72, as it supports semiconductor material preparation for ADP systems.
PCI Express Backplane Connector
A PCI Express backplane connector is a high-speed interconnect used to link printed circuit assemblies (PCAs) to backplanes in servers and computing systems. It ensures reliable data transmission between PCAs and other system components, making it an essential part for automatic data processing machines of heading 84.71. This connector is equally suitable for use with machines of headings 84.70 to 84.72, hence its classification under tariff item 8473.50.90.