Chapter 8473 — Customs Tariff Headings

8473.30Parts and accessories of the machines of heading 84.71

8473.40.00Parts and accessories of the machines of heading 84.72

8473.50Parts and accessories equally suitable for use with the machines of two or more of the headings 84.70 to 84.72

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Products classified under Tariff item 84.73

3DS Stacked 16GB HBM2 Memory Module

This 16GB High Bandwidth Memory 2 (HBM2) module uses 3D stacking technology for AI accelerators and high-performance workstations of heading 84.71. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

CMP Polisher Motor Driver Assembly

This printed circuit assembly (PCA) drives stepper motors for slurry flow and pad conditioning in chemical mechanical planarization polishers for semiconductor wafers. It ensures precise control of polishing processes. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Crystal Grinder Diameter Control PCA

This printed circuit assembly is designed for automated crystal grinders that shape semiconductor boules to precise wafer diameters and grind orientation flats. It processes laser measurement feedback for closed-loop diameter control, ensuring accurate and consistent grinding. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Crystal Grower Control Printed Circuit Board

This printed circuit assembly regulates temperature and pull speed in Czochralski crystal growers used to produce monocrystalline silicon boules for semiconductor wafers. It is a dedicated control board for these specific machines. As a part suitable solely for machines of heading 84.71, it falls under tariff item 8473.30.20.

DDR3 4GB Legacy SODIMM Module

This 4GB DDR3 SODIMM module is designed for legacy laptops and embedded systems compatible with older computers of heading 84.71. The printed circuit assembly maintains compatibility with aging data processing infrastructure. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

DDR4 64GB Workstation RAM Module

This high-capacity 64GB DDR4 DIMM module is optimized for professional workstations and CAD computers of heading 84.71. The multi-rank printed circuit assembly supports demanding graphics and simulation workloads. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

DDR4 SODIMM 8GB Laptop RAM Module

This small outline dual in-line memory module (SODIMM) with 8GB DDR4 SDRAM capacity is designed specifically for laptops and compact computers classified under heading 84.71. It consists of a printed circuit assembly populated with DRAM chips. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

DDR5 16GB Desktop DIMM RAM Module

This 16GB DDR5 dual in-line memory module (DIMM) is designed for desktop computers and workstations under heading 84.71, featuring a printed circuit board with multiple DRAM ICs and a memory controller interface. It provides high-speed data access for computing tasks. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Deposition Chamber Vacuum Controller

This PCA monitors turbopump speed and pressure in PVD/CVD chambers depositing thin films on semiconductor wafers. It is a dedicated control board for these deposition machines. As a printed circuit part principally for machines of heading 84.71, it falls under tariff item 8473.30.20.

Dicing Saw Laser Alignment Board

This printed circuit assembly processes laser alignment signals for wafer dicing saws cutting finished IC dice. It ensures scribe lane precision during the dicing process. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

ECC Registered 32GB Server RDIMM Module

This 32GB error-correcting code (ECC) registered DIMM (RDIMM) module is designed for enterprise servers and data center computers of heading 84.71. The printed circuit assembly includes buffered DRAM chips for reliable high-capacity memory. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Etch Chamber Plasma Controller Board

This printed circuit assembly generates RF plasma for reactive ion etching of semiconductor wafers in plasma etch tools. It enables anisotropic pattern transfer during the etching process. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Float Zone Crystal Grower Power Supply PCA

This printed circuit assembly provides high-frequency RF power control for float zone crystal growers that produce ultra-pure silicon ingots for semiconductor wafers. It regulates zone melting parameters critical for defect-free crystal growth. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Float Zone Furnace Power PCA

This printed circuit assembly manages high-current RF power delivery in float zone crystal pullers for ultra-pure semiconductor ingots. It is a dedicated control board for these specific machines. As a non-CRT part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Ion Implanter Beamline Control PCA

This PCA regulates ion beam current, energy, and scan in ion implanters doping semiconductor wafers. It achieves dose uniformity of less than 1% during implantation. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.

LPDDR4X 4GB Mobile SoC RAM Module

This low-power DDR4X 4GB RAM module in BGA package is designed for system-on-chip integration in tablets and ultrabooks under heading 84.71. This compact printed circuit assembly delivers efficient memory for mobile computing devices. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

PCI Express Riser Card

This is a printed circuit assembly component that extends PCI Express slots, allowing additional connectivity in automatic data processing machines. It is designed solely or principally for use with ADP machines of heading 84.71, such as servers or workstations. As a printed circuit assembly, it is classified under tariff item 8473.30.20, which covers such assemblies for machines of heading 84.71.

Photoresist Spinner Drive Electronics

This PCA controls high-speed spin coating of photoresist on semiconductor wafers in lithography prep stations. It achieves uniform thickness during the coating process. As a dedicated printed circuit part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Registered 128GB Server LRDIMM Module

This load-reduced 128GB LRDIMM module is designed for high-density server farms and cloud computing systems under heading 84.71. This advanced printed circuit assembly uses buffer chips to handle extreme memory loads. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Semiconductor Fab Vacuum Pump Controller Board

This printed circuit assembly (PCA) controls turbomolecular vacuum pumps used in semiconductor wafer processing equipment. It manages pump speed, pressure setpoints, and vibration isolation, ensuring precise vacuum conditions for manufacturing processes. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Semiconductor Handler Pick-and-Place PCA

This printed circuit assembly coordinates vacuum pick-and-place mechanisms in die handlers for semiconductor device assembly. It handles precise die transfer from wafer to packaging. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Semiconductor Wafer Crystal Puller Control Board

This printed circuit assembly (PCA) is the main control board for Czochralski crystal pullers used in producing monocrystalline silicon boules for semiconductor wafers. It manages temperature, rotation, and pulling parameters critical for crystal growth. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Semiconductor Wafer Prober Test PCB

This printed circuit assembly is designed specifically for control electronics in wafer probers used to test semiconductor devices during manufacturing. It is a part suitable solely for machines of heading 84.71. As such, it falls under tariff item 8473.30.20.

Wafer Edge Grinder Vision PCA

This printed circuit board processes machine vision edge profiles during semiconductor wafer edge grinding. It prevents chipping during handling. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Wafer Grinder Servo Drive PCA

This printed circuit assembly provides servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It is a principal part of machines of heading 84.71. As such, it falls under tariff item 8473.30.20.

Wafer Handling Robot Motion Controller PCA

This printed circuit assembly (PCA) provides real-time trajectory control for wafer handling robots in cluster tools, transferring wafers between semiconductor processing chambers. It ensures sub-micron repeatability in robot motion. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Wafer Inspection Stepper Interface PCA

This PCA controls stage motion in step-and-repeat wafer inspection systems mapping defects pre-lithography. It achieves sub-micron alignment during inspection. As a printed circuit accessory for machines of heading 84.71, it falls under tariff item 8473.30.20.

Wafer Lapping Machine Interface PCA

This printed circuit board assembly interfaces pressure sensors and motors in lapping equipment that achieves flatness tolerances for semiconductor wafers pre-polishing. It is a part principally for machines of heading 84.71. As such, it falls under tariff item 8473.30.20.

Wafer Lapping Machine Pressure Control Board

This printed circuit assembly (PCA) regulates pneumatic pressure systems in wafer lapping machines, maintaining nanometer-level flatness tolerances for semiconductor wafer fabrication. It ensures uniform pressure distribution across wafer surfaces. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Wafer Polisher Rotation Controller PCA

This printed circuit assembly (PCA) controls multi-platen rotation speeds in chemical mechanical planarization (CMP) wafer polishers for semiconductor devices. It ensures uniform material removal rates across wafer surfaces. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Wafer Slicing Saw Controller Board

This is a specialized printed circuit assembly (PCA) that controls blade speed and coolant flow in diamond saws used to slice monocrystalline boules into semiconductor wafers. It is designed solely or principally for use with automatic data processing machines of heading 84.71, such as the controller systems in these saws. As a printed circuit assembly, it is classified under tariff item 8473.30.20, which covers such assemblies for machines of heading 84.71.

Wafer Slicing Saw Servo Drive Printed Circuit Board

This printed circuit assembly (PCA) controls precision servo motors in wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It ensures micron-level accuracy in blade positioning and feed rates. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

AI Accelerator Card Secure Mount Kit

A security-enhanced mounting kit with tamper-evident latches and faceplates designed for AI accelerator cards used in high-performance computing clusters. These accessories are specifically for printed circuit assemblies, making them classifiable under tariff item 8473.30.30.

Blade Server Circuit Board Bracket

A precision-engineered bracket with thumb-screw lock latch for blade server daughterboard assemblies. This bracket is a lock latch accessory specifically for printed circuit assemblies in high-density computing systems, falling under tariff item 8473.30.30.

Data Center Motherboard PCIe Riser Bracket

An adjustable riser bracket with secure lock latch for vertical GPU mounting in 4U+ data center motherboards. This bracket is a face plate and lock latch accessory for printed circuit assemblies, classifiable under tariff item 8473.30.30.

Embedded System PCB Mounting Latch

A low-profile latch assembly for securing CompactPCI/SBC cards in embedded data processing systems. This latch is a lock latch accessory for printed circuit assemblies, falling under tariff item 8473.30.30.

GPU Expansion Slot Bracket with Latch

A metal face plate and lock latch assembly for securing high-end graphics cards in printed circuit board slots of automatic data processing machines. This assembly is specifically provided for under tariff item 8473.30.30 as an accessory of printed circuit assemblies.

GPU Server Lockable Expansion Bracket

A heavy-duty lockable bracket with keyed latch for enterprise GPU servers' printed circuit expansion slots. This bracket is a lock latch accessory for printed circuit assemblies, classifiable under tariff item 8473.30.30.

High-Density Server PCIe Faceplate

A custom face plate with integrated lock latch for 1U server PCIe slots, designed for printed circuit assemblies in rackmount data processing systems. This face plate meets the criteria for tariff item 8473.30.30 as a part of heading 8471 machines.

Industrial PC Expansion Card Lock

A heavy-duty lock latch mechanism for securing ISA/PCI cards in ruggedized industrial printed circuit assemblies. This lock latch is explicitly provided for under tariff item 8473.30.30 as an accessory of heading 8471 assemblies.

ATM Cash Dispenser Control Assembly

This printed circuit assembly coordinates the cassette motors, sensors, and dispensing mechanisms in automatic teller machines (ATMs), including anti-jam detection and note validation. It is a part or accessory suitable for use solely or principally with machines of heading 84.72, specifically ATMs classified under tariff item 8472.90.10.

ATM Display Interface PCB Assembly

This printed circuit assembly controls the LCD/LED touchscreen and user interface graphics for ATMs, integrating display drivers and touch controllers. It is a dedicated component for ATMs classified under heading 84.72, making it a part or accessory of those machines under tariff item 8473.40.00.

ATM Main Control Board PCB Assembly

This printed circuit assembly serves as the central processing unit board for automatic teller machines (ATMs), handling core transaction processing and system control. It is specifically designed for ATMs of heading 84.72, qualifying as a part or accessory under tariff item 8473.40.00.

ATM Network Interface Circuit Board

This PCA enables Ethernet, modem, and secure network connectivity for remote ATM management and transactions, with banking-grade firewalls. It is tailored for ATMs of heading 84.72, making it a part or accessory under tariff item 8473.40.00.

ATM Power Management PCB

This PCA regulates voltage, power distribution, and UPS interfacing for ATM internal components, with fault-tolerant designs for 24/7 banking. It is specifically engineered for ATMs of heading 84.72, qualifying as a part or accessory under tariff item 8473.40.00.

ATM Security Module Circuit Assembly

This printed circuit assembly houses hardware security modules (HSM) for encryption, key management, and fraud detection in ATMs, meeting PCI DSS standards. It is exclusively used in ATMs of heading 84.72, making it a part or accessory under tariff item 8473.40.00.

ATM Transaction Processor Circuit Board

This specialized printed circuit assembly manages card reader interfaces, PIN pad encryption, and transaction validation in ATMs. It is classified under tariff item 8473.40.00 due to its principal use with ATMs of heading 84.72.

Boule Handling Robot End-Effector

A custom vacuum gripper and rotation mechanism designed exclusively for handling heavy semiconductor crystal boules during processing. It is a part suitable for use principally with boule handling machines of heading 84.72, facilitating safe and precise manipulation. This end-effector is essential for automated boule processing lines.

Chemical Mechanical Wafer Polisher

A chemical mechanical polisher (CMP) that uses chemical slurry and mechanical force to achieve atomic-level surface flatness on semiconductor wafers. It is specifically designed as final wafer preparation apparatus for machines of heading 84.72, ensuring high-quality surfaces for subsequent processing. This polisher is integral to semiconductor manufacturing lines.

CMP Wafer Polishing Pad Conditioner

A diamond disk conditioner for dressing chemical mechanical polishing (CMP) pads used in semiconductor wafer fabrication. It maintains pad surface asperity for uniform material removal. This accessory is suitable for use solely or principally with CMP polishers of heading 84.72 and is classified under tariff item 8473.40.00.

Crystal Boule Grinder

A precision grinding machine that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. It is specifically designed as wafer preparation equipment for machines of heading 84.72, ensuring precise dimensions for downstream processing. This grinder is essential for producing semiconductor wafers.

Crystal Boule Grinder Flatting Wheel

A specialized grinding wheel for creating orientation flats on silicon boules to indicate crystal plane and doping type, used in crystal grinders of heading 84.72. It ensures wafers sliced from the boule have correct conductivity markings. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.

Crystal Grinder Coolant Filtration System

A high-purity coolant recirculation and filtration system designed specifically for semiconductor crystal grinding processes. It is an essential accessory that maintains particle-free processing environments for machines of heading 84.72, ensuring consistent grinding quality. This system is critical for preventing contamination during wafer preparation.

Crystal Ingot Weighing Sensor Assembly

A load cell assembly integrated into Czochralski pullers (heading 84.72) for real-time monitoring of crystal growth weight and pull rate control. It ensures boule diameter uniformity during semiconductor manufacturing. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.

Czochralski Crystal Puller Furnace

A high-temperature furnace used to produce monocrystalline silicon boules via the Czochralski method for semiconductor wafer manufacturing. It is a key component classified as a part of semiconductor manufacturing equipment of heading 84.72, enabling crystal growth. This furnace is fundamental to producing high-purity silicon ingots.

Czochralski Crystal Puller Heater Element

A graphite or molybdenum heater element designed specifically for Czochralski crystal growers used in semiconductor wafer production, falling under machines of heading 84.72. It provides precise high-temperature control for crystal growth. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.

Diamond Wire Wafer Saw Consumable Loader

An automated loading system for diamond wire spools and slurry systems in high-throughput wafer slicing saws. It is an accessory suitable solely for machines of heading 84.72, enabling continuous operation of semiconductor slicing equipment. This loader enhances efficiency and precision in wafer production.

Float Zone Crystal Grower

An apparatus employing the float zone method to produce ultra-pure monocrystalline semiconductor ingots from polycrystalline rods. It is classified as a part or accessory for machines of heading 84.72, enabling high-purity crystal growth. This equipment is essential for producing semiconductor materials with minimal impurities.

Float Zone Crystal Grower RF Coil

A radio frequency induction coil used in float zone furnaces for producing high-purity silicon crystals from polycrystalline rods, specific to machines of heading 84.72. It generates the molten zone for zone refining without crucibles. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.