CMP Wafer Polishing Pad Conditioner
A diamond disk conditioner for dressing chemical mechanical polishing (CMP) pads used in semiconductor wafer fabrication. It maintains pad surface asperity for uniform material removal. This accessory is suitable for use solely or principally with CMP polishers of heading 84.72 and is classified under tariff item 8473.40.00.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the conditioner is a part of a machine-tool rather than an accessory of a polisher
Parts and accessories of machine-tools are classified under heading 84.66.
If the conditioner is presented as a diamond abrasive tool rather than a machine part
Millstones, grindstones and other abrasive articles are classified under heading 68.04.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm that the pad conditioner is designed for use with CMP polishers classified under heading 84.72, as this is essential for classification under this item
• If the conditioner is a tool of heading 82.07, it may be excluded from this chapter
• Keep records of the specific polisher model it is intended for to support your declaration
Related Products under Tariff item 8473.40.00
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