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Ion Implanter Beamline Control PCA

This PCA regulates ion beam current, energy, and scan in ion implanters doping semiconductor wafers. It achieves dose uniformity of less than 1% during implantation. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
🇨🇳ChinaFree—Free
🇲🇽MexicoFree—Free
🇺🇸United StatesFree—Free
🇩🇪GermanyFree—Free
🇯🇵JapanFree—Free

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8473.30.90Same rate: Free

If the PCA is not a printed circuit assembly

Other parts and accessories of machines of heading 84.71 are classified under this residual item.

8479.89.90Same rate: Free

If the ion implanter is not of heading 84.71

Machines having individual functions not specified elsewhere are classified under heading 84.79.

8543.70.00Same rate: Free

If the PCA is an electrical machine with individual functions

Electrical machines and apparatus having individual functions are classified under heading 85.43.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Confirm the PCA is principally used with ion implanters of heading 84.71

• Keep records of the machine's classification to support the PCA's classification

• Check for any applicable duty relief programs for semiconductor manufacturing equipment

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This 16GB High Bandwidth Memory 2 (HBM2) module uses 3D stacking technology for AI accelerators and high-performance workstations of heading 84.71. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

CMP Polisher Motor Driver Assembly

This printed circuit assembly (PCA) drives stepper motors for slurry flow and pad conditioning in chemical mechanical planarization polishers for semiconductor wafers. It ensures precise control of polishing processes. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.

Crystal Grinder Diameter Control PCA

This printed circuit assembly is designed for automated crystal grinders that shape semiconductor boules to precise wafer diameters and grind orientation flats. It processes laser measurement feedback for closed-loop diameter control, ensuring accurate and consistent grinding. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.

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This printed circuit assembly regulates temperature and pull speed in Czochralski crystal growers used to produce monocrystalline silicon boules for semiconductor wafers. It is a dedicated control board for these specific machines. As a part suitable solely for machines of heading 84.71, it falls under tariff item 8473.30.20.

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