Printed circuit assemblies
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 84.70 to 84.72. > Parts and accessories of the machines of heading 84.71 > Printed circuit assemblies > Printed circuit assemblies
Duty Rate (from China)
Products classified under Tariff item 8473.30.20.00
3DS Stacked 16GB HBM2 Memory Module
This 16GB High Bandwidth Memory 2 (HBM2) module uses 3D stacking technology for AI accelerators and high-performance workstations of heading 84.71. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20CMP Polisher Motor Driver Assembly
This printed circuit assembly (PCA) drives stepper motors for slurry flow and pad conditioning in chemical mechanical planarization polishers for semiconductor wafers. It ensures precise control of polishing processes. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Crystal Grinder Diameter Control PCA
This printed circuit assembly is designed for automated crystal grinders that shape semiconductor boules to precise wafer diameters and grind orientation flats. It processes laser measurement feedback for closed-loop diameter control, ensuring accurate and consistent grinding. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Crystal Grower Control Printed Circuit Board
This printed circuit assembly regulates temperature and pull speed in Czochralski crystal growers used to produce monocrystalline silicon boules for semiconductor wafers. It is a dedicated control board for these specific machines. As a part suitable solely for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20DDR3 4GB Legacy SODIMM Module
This 4GB DDR3 SODIMM module is designed for legacy laptops and embedded systems compatible with older computers of heading 84.71. The printed circuit assembly maintains compatibility with aging data processing infrastructure. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20DDR4 64GB Workstation RAM Module
This high-capacity 64GB DDR4 DIMM module is optimized for professional workstations and CAD computers of heading 84.71. The multi-rank printed circuit assembly supports demanding graphics and simulation workloads. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20DDR4 SODIMM 8GB Laptop RAM Module
This small outline dual in-line memory module (SODIMM) with 8GB DDR4 SDRAM capacity is designed specifically for laptops and compact computers classified under heading 84.71. It consists of a printed circuit assembly populated with DRAM chips. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20DDR5 16GB Desktop DIMM RAM Module
This 16GB DDR5 dual in-line memory module (DIMM) is designed for desktop computers and workstations under heading 84.71, featuring a printed circuit board with multiple DRAM ICs and a memory controller interface. It provides high-speed data access for computing tasks. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Deposition Chamber Vacuum Controller
This PCA monitors turbopump speed and pressure in PVD/CVD chambers depositing thin films on semiconductor wafers. It is a dedicated control board for these deposition machines. As a printed circuit part principally for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Dicing Saw Laser Alignment Board
This printed circuit assembly processes laser alignment signals for wafer dicing saws cutting finished IC dice. It ensures scribe lane precision during the dicing process. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20ECC Registered 32GB Server RDIMM Module
This 32GB error-correcting code (ECC) registered DIMM (RDIMM) module is designed for enterprise servers and data center computers of heading 84.71. The printed circuit assembly includes buffered DRAM chips for reliable high-capacity memory. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Etch Chamber Plasma Controller Board
This printed circuit assembly generates RF plasma for reactive ion etching of semiconductor wafers in plasma etch tools. It enables anisotropic pattern transfer during the etching process. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Float Zone Crystal Grower Power Supply PCA
This printed circuit assembly provides high-frequency RF power control for float zone crystal growers that produce ultra-pure silicon ingots for semiconductor wafers. It regulates zone melting parameters critical for defect-free crystal growth. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Float Zone Furnace Power PCA
This printed circuit assembly manages high-current RF power delivery in float zone crystal pullers for ultra-pure semiconductor ingots. It is a dedicated control board for these specific machines. As a non-CRT part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Ion Implanter Beamline Control PCA
This PCA regulates ion beam current, energy, and scan in ion implanters doping semiconductor wafers. It achieves dose uniformity of less than 1% during implantation. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20LPDDR4X 4GB Mobile SoC RAM Module
This low-power DDR4X 4GB RAM module in BGA package is designed for system-on-chip integration in tablets and ultrabooks under heading 84.71. This compact printed circuit assembly delivers efficient memory for mobile computing devices. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20PCI Express Riser Card
This is a printed circuit assembly component that extends PCI Express slots, allowing additional connectivity in automatic data processing machines. It is designed solely or principally for use with ADP machines of heading 84.71, such as servers or workstations. As a printed circuit assembly, it is classified under tariff item 8473.30.20, which covers such assemblies for machines of heading 84.71.
8473.30.20Photoresist Spinner Drive Electronics
This PCA controls high-speed spin coating of photoresist on semiconductor wafers in lithography prep stations. It achieves uniform thickness during the coating process. As a dedicated printed circuit part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Registered 128GB Server LRDIMM Module
This load-reduced 128GB LRDIMM module is designed for high-density server farms and cloud computing systems under heading 84.71. This advanced printed circuit assembly uses buffer chips to handle extreme memory loads. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Semiconductor Fab Vacuum Pump Controller Board
This printed circuit assembly (PCA) controls turbomolecular vacuum pumps used in semiconductor wafer processing equipment. It manages pump speed, pressure setpoints, and vibration isolation, ensuring precise vacuum conditions for manufacturing processes. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Semiconductor Handler Pick-and-Place PCA
This printed circuit assembly coordinates vacuum pick-and-place mechanisms in die handlers for semiconductor device assembly. It handles precise die transfer from wafer to packaging. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Semiconductor Wafer Crystal Puller Control Board
This printed circuit assembly (PCA) is the main control board for Czochralski crystal pullers used in producing monocrystalline silicon boules for semiconductor wafers. It manages temperature, rotation, and pulling parameters critical for crystal growth. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Semiconductor Wafer Prober Test PCB
This printed circuit assembly is designed specifically for control electronics in wafer probers used to test semiconductor devices during manufacturing. It is a part suitable solely for machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
8473.30.20Wafer Edge Grinder Vision PCA
This printed circuit board processes machine vision edge profiles during semiconductor wafer edge grinding. It prevents chipping during handling. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Wafer Grinder Servo Drive PCA
This printed circuit assembly provides servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It is a principal part of machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
8473.30.20Wafer Handling Robot Motion Controller PCA
This printed circuit assembly (PCA) provides real-time trajectory control for wafer handling robots in cluster tools, transferring wafers between semiconductor processing chambers. It ensures sub-micron repeatability in robot motion. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Wafer Inspection Stepper Interface PCA
This PCA controls stage motion in step-and-repeat wafer inspection systems mapping defects pre-lithography. It achieves sub-micron alignment during inspection. As a printed circuit accessory for machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Wafer Lapping Machine Interface PCA
This printed circuit board assembly interfaces pressure sensors and motors in lapping equipment that achieves flatness tolerances for semiconductor wafers pre-polishing. It is a part principally for machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
8473.30.20Wafer Lapping Machine Pressure Control Board
This printed circuit assembly (PCA) regulates pneumatic pressure systems in wafer lapping machines, maintaining nanometer-level flatness tolerances for semiconductor wafer fabrication. It ensures uniform pressure distribution across wafer surfaces. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Wafer Polisher Rotation Controller PCA
This printed circuit assembly (PCA) controls multi-platen rotation speeds in chemical mechanical planarization (CMP) wafer polishers for semiconductor devices. It ensures uniform material removal rates across wafer surfaces. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
8473.30.20Wafer Slicing Saw Controller Board
This is a specialized printed circuit assembly (PCA) that controls blade speed and coolant flow in diamond saws used to slice monocrystalline boules into semiconductor wafers. It is designed solely or principally for use with automatic data processing machines of heading 84.71, such as the controller systems in these saws. As a printed circuit assembly, it is classified under tariff item 8473.30.20, which covers such assemblies for machines of heading 84.71.
8473.30.20Wafer Slicing Saw Servo Drive Printed Circuit Board
This printed circuit assembly (PCA) controls precision servo motors in wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It ensures micron-level accuracy in blade positioning and feed rates. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.