Chemical Mechanical Wafer Polisher
A chemical mechanical polisher (CMP) that uses chemical slurry and mechanical force to achieve atomic-level surface flatness on semiconductor wafers. It is specifically designed as final wafer preparation apparatus for machines of heading 84.72, ensuring high-quality surfaces for subsequent processing. This polisher is integral to semiconductor manufacturing lines.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the polisher is a standalone machine for working stone or similar materials
Heading 84.64 covers machine-tools for working stone, ceramics, and similar hard materials, which may apply if not specific to heading 84.72.
If the polisher performs a mixing, kneading, or other general function
Machines for mixing, kneading, or crushing are classified in heading 84.79, and their parts may be classified accordingly.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm that the polisher is a part or accessory of a machine of heading 84.72, not a standalone machine, to use this tariff item
• Keep records of its intended use with specific wafer preparation machines
• Be aware that CMP polishers may require environmental compliance documentation for chemical slurry handling
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