Wafer Slicing Diamond Saw Blade from China
A wafer slicing diamond saw blade is a high-precision diamond-impregnated blade designed exclusively for slicing semiconductor boules into thin wafers in wafer preparation equipment. It ensures precise cuts with minimal damage, critical for wafer yield. This blade is equally suitable for use with machines of headings 84.70 to 84.72, supporting wafer preparation for ADP systems.
Duty Rate — China → Canada
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Import Tips
• Ensure the saw blade is declared as a part of semiconductor processing equipment, not as an interchangeable tool of Chapter 82
• Provide evidence of its exclusive use in wafer slicing machines
• Check if the blade qualifies for duty relief under Canada's programs for semiconductor manufacturing equipment