Other machinery and apparatus
Machinery and apparatus for soldering, brazing or welding, whether or not capable of cutting, other than those of heading 85.15; gas-operated surface tempering machines and appliances. > Other machinery and apparatus > Other machinery and apparatus
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8468.80
Automated Wafer Grinder for Backside
The Automated Wafer Grinder for Backside is a machine used to reduce semiconductor wafer thickness for 3D packaging. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Boule Diameter Grinder
The Boule Diameter Grinder is a precision grinder for reducing semiconductor boule diameter. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Chemical Mechanical Wafer Polisher
The Chemical Mechanical Wafer Polisher is a CMP polisher for planarization of semiconductor wafers. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Crystal boule Flattener
The Crystal Boule Flattener is an apparatus for grinding orientation flats on semiconductor boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Crystal Boule Grinder
The Crystal Boule Grinder is a precision grinder for shaping semiconductor crystal boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Crystal Puller for Semiconductor Wafer Production
The Crystal Puller for Semiconductor Wafer Production is a Czochralski method crystal puller used to grow monocrystalline silicon boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
8468.80.00Double-Sided Wafer Lapper
A machine for simultaneous lapping of both sides of semiconductor wafers using planetary motion carriers, achieving total thickness variation under 1 micron. It is essential for advanced semiconductor manufacturing, classified here as other machinery for soldering or welding-like precision surface processing.
8468.80.00ESAB Rogue ES 180i Stick Welder
The ESAB Rogue ES 180i is an inverter-based stick welder designed for manual metal arc welding. It is operated by hand, with the user controlling the electrode holder and adjusting power settings, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery and apparatus for soldering, brazing or welding, not covered by heading 85.15.
8468.80.00Float Zone Crystal Grower
Float zone apparatus for producing monocrystalline semiconductor boules using zone melting without a crucible, featuring RF heating coils for localized melting. It is ideal for high-purity silicon and gallium arsenide, classified here as other machinery for heat treatment similar to tempering.
8468.80.00Forney 313 Easy Weld 140 MP MIG Welder
The Forney 313 Easy Weld 140 MP is a multi-process welder capable of MIG, stick, and DC TIG welding. It is portable and operated manually, with the user controlling the torch and electrode, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not of heading 85.15.
8468.80.00High-Purity Silicon Wafer Edge Grinder
Edge profiling grinder for semiconductor wafers to prevent chipping and enable handling, creating chamfers with specific radii. It is essential post-slicing, classified here as other machinery for precision surface processing akin to tempering.
8468.80.00Hobart Champion Elite 225 Welder Generator
The Hobart Champion Elite 225 is an engine-driven stick welder designed for field repairs. It is operated manually, with the user controlling the arc and electrode holder, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not covered by heading 85.15.
8468.80.00Hypertherm Powermax 45 Plasma Cutter
The Hypertherm Powermax 45 is a handheld plasma arc cutting tool used to sever metal. It is operated by hand, with the user controlling the torch, making it a hand-controlled apparatus for cutting via a plasma process. This falls under tariff item 8468.80.00 as other machinery for welding or cutting, not of heading 85.15.
8468.80.00IRWIN Quick-Grip MIG Welding Pliers Set
Specialized hand-held pliers designed for MIG welding cleanup, including crimping nozzles and removing tips. They are classified under this tariff item as accessories for welding machinery and apparatus, given their direct association with welding operations.
8468.80.00Lincoln Electric Handy MIG 140 Welder
The Lincoln Electric Handy MIG 140 is a compact MIG welder designed for light fabrication and repair. It is operated manually, with the user controlling the wire feed and torch, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not covered by heading 85.15.
8468.80.00Miller Syncrowave 200 TIG Welder
The Miller Syncrowave 200 is a TIG welding machine used for precision welding of stainless steel and aluminum. It is operated by hand, with the user controlling the torch and foot pedal, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not of heading 85.15.
8468.80.00Multi-Wire Wafer Slicer
Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. It is high-speed for production volumes, classified here as other cutting machinery for semiconductor materials.
8468.80.00PrimeWeld TIG225X AC/DC TIG Welder
The PrimeWeld TIG225X is an AC/DC TIG welder with foot pedal control for precision welding. It is operated manually, with the user directing the torch and adjusting settings, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not covered by heading 85.15.
8468.80.00RF Heating Zone Refiner
Radio frequency zone refiner for purifying semiconductor polycrystals into monocrystalline form via repeated zone passes. It is used in float zone processes for ultra-high purity, classified here as other machinery for heat treatment.
8468.80.00Semiconductor Crystal Annealer
Rapid thermal annealer using welding-like high-temperature processing to relieve stresses in grown semiconductor crystals post-pulling. It improves yield, classified here as a tempering appliance for semiconductor surfaces.
8468.80.00Semiconductor Wafer Polisher
Chemical-mechanical planarization (CMP) polisher for final surface finishing of semiconductor wafers, achieving mirror-like flatness for circuit fabrication. It uses polishing pads and slurries, classified here as other machinery for surface tempering.
8468.80.00Semiconductor Wafer Slicing Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. It is critical for wafer preparation in device fabrication, classified here as other cutting machinery.
8468.80.00Wafer Lapping Machine
Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. It prepares wafer surfaces for photolithography, classified here as other machinery for precision surface processing.
8468.80.00Weldpro 155A Digital MIG Welder
The Weldpro 155A Digital MIG Welder is a compact inverter MIG/stick combo with a hand torch for DIY metalwork. It is operated manually, with the user controlling the torch and digital settings, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not of heading 85.15.
8468.80.00YesWelder MIG-205DS MIG Welder
The YesWelder MIG-205DS is a digital spool gun MIG welder for aluminum and steel, operated by the user for garage fabrication. It is hand-controlled, with the user directing the torch and wire feed, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery for welding, not covered by heading 85.15.