ESAB Rogue ES 180i Stick Welder
The ESAB Rogue ES 180i is an inverter-based stick welder designed for manual metal arc welding. It is operated by hand, with the user controlling the electrode holder and adjusting power settings, making it a hand-controlled welding apparatus. This falls under tariff item 8468.80.00 as other machinery and apparatus for soldering, brazing or welding, not covered by heading 85.15.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the welder is electrically operated for arc welding
Electric arc welding machines fall under heading 85.15, which is excluded from this tariff item.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the welder is classified under 8468.80.00, not 8515, as it is not electric arc welding machinery
• Verify the country of origin for applicable free trade agreements to potentially reduce duties
• Keep the user manual and technical specs available for CBSA inspection
Related Products under Tariff item 8468.80.00
Automated Wafer Grinder for Backside
The Automated Wafer Grinder for Backside is a machine used to reduce semiconductor wafer thickness for 3D packaging. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Boule Diameter Grinder
The Boule Diameter Grinder is a precision grinder for reducing semiconductor boule diameter. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Chemical Mechanical Wafer Polisher
The Chemical Mechanical Wafer Polisher is a CMP polisher for planarization of semiconductor wafers. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal boule Flattener
The Crystal Boule Flattener is an apparatus for grinding orientation flats on semiconductor boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Boule Grinder
The Crystal Boule Grinder is a precision grinder for shaping semiconductor crystal boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Puller for Semiconductor Wafer Production
The Crystal Puller for Semiconductor Wafer Production is a Czochralski method crystal puller used to grow monocrystalline silicon boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.