Semiconductor Wafer Slicing Saw
High-precision diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. It is critical for wafer preparation in device fabrication, classified here as other cutting machinery.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the saw is solely or principally used for semiconductor manufacture
Machines for the manufacture of semiconductor devices are classified in heading 84.86.
If the saw is a general-purpose cutting machine
Other machine tools for cutting metals or cermets fall under heading 84.61.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Verify if heading 84.86 applies for semiconductor manufacturing equipment
• Provide saw specifications and wafer slicing process details
• Ensure compliance with Canadian safety standards for cutting machinery
Related Products under Tariff item 8468.80.00
Automated Wafer Grinder for Backside
The Automated Wafer Grinder for Backside is a machine used to reduce semiconductor wafer thickness for 3D packaging. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Boule Diameter Grinder
The Boule Diameter Grinder is a precision grinder for reducing semiconductor boule diameter. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Chemical Mechanical Wafer Polisher
The Chemical Mechanical Wafer Polisher is a CMP polisher for planarization of semiconductor wafers. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal boule Flattener
The Crystal Boule Flattener is an apparatus for grinding orientation flats on semiconductor boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Boule Grinder
The Crystal Boule Grinder is a precision grinder for shaping semiconductor crystal boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Puller for Semiconductor Wafer Production
The Crystal Puller for Semiconductor Wafer Production is a Czochralski method crystal puller used to grow monocrystalline silicon boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.