IRWIN Quick-Grip MIG Welding Pliers Set
Specialized hand-held pliers designed for MIG welding cleanup, including crimping nozzles and removing tips. They are classified under this tariff item as accessories for welding machinery and apparatus, given their direct association with welding operations.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | β | Free |
| π²π½Mexico | Free | β | Free |
| πΊπΈUnited States | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the pliers are considered general-purpose hand tools
Hand tools of base metal not elsewhere specified fall under heading 82.05.
If the pliers are sold as parts of electric welding equipment
Parts of electric welding machines are classified under heading 85.15.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β and can price the duty on it in the same conversation.
Import Tips & Compliance
β’ Ensure the pliers are declared as accessories to welding apparatus, not as hand tools of Chapter 82
β’ Keep invoices showing the welding-specific design to support classification
β’ Verify if a Canadian Standards Association (CSA) certification is required for workplace use
Related Products under Tariff item 8468.80.00
Automated Wafer Grinder for Backside
The Automated Wafer Grinder for Backside is a machine used to reduce semiconductor wafer thickness for 3D packaging. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Boule Diameter Grinder
The Boule Diameter Grinder is a precision grinder for reducing semiconductor boule diameter. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Chemical Mechanical Wafer Polisher
The Chemical Mechanical Wafer Polisher is a CMP polisher for planarization of semiconductor wafers. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal boule Flattener
The Crystal Boule Flattener is an apparatus for grinding orientation flats on semiconductor boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Boule Grinder
The Crystal Boule Grinder is a precision grinder for shaping semiconductor crystal boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.
Crystal Puller for Semiconductor Wafer Production
The Crystal Puller for Semiconductor Wafer Production is a Czochralski method crystal puller used to grow monocrystalline silicon boules. It is not a welding or soldering apparatus, and it is not hand-controlled, so it does not fall under tariff item 8468.80.00. This candidate is excluded based on the chapter notes, as it is a machine for semiconductor manufacturing, which is covered by heading 84.86.