Wafer Edge Grinding Machine
A wafer edge grinding machine that chamfers and profiles wafer edges to prevent chipping during handling and processing. This machine ensures wafer integrity before fabrication in semiconductor production lines.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is solely or principally used for semiconductor manufacture
Heading 84.86 covers machines for semiconductor manufacturing, which is more specific.
If the machine is a general-purpose edge grinding machine
Heading 84.60 covers grinding machines for metal or cermets, which may apply.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the machine correctly as a machine-tool for working hard materials, and have documentation ready to show it is not semiconductor manufacturing equipment under heading 84.86
• Provide CBSA with the machine's technical specifications
• Check if the machine qualifies for duty-free treatment under a free trade agreement
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