Other
Machine-tools (including machines for nailing, stapling, glueing or otherwise assembling) for working wood, cork, bone, hard rubber, hard plastics or similar hard materials. > Other: > Splitting, slicing or paring machines > For working wood: > Other
Duty Rate (from China)
Products classified under Tariff item 8465.96.00.90
Commercial 30-Ton PTO Log Splitter
A professional-grade log splitter driven by tractor PTO with 30 tons of force for high-volume firewood production. It falls under this tariff item as a splitting machine for woodworking, specifically designed to split logs along the grain.
8465.96.00Crystal Boule Slicing Machine
A high-precision machine that uses diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. It falls under this tariff item as a slicing machine specifically designed for hard materials like silicon, which are similar to hard plastics or hard rubber.
8465.96.00Diamond Wire Wafer Slicer
A multi-wire diamond saw that uses fixed abrasive technology to slice multiple wafers from silicon boules simultaneously. This slicing machine is designed for hard semiconductor materials, which are similar to hard plastics or hard rubber, and thus falls under this tariff item.
8465.96.00Disk Wood Chippers
Rotary disk chippers that pare and chip wood logs or slabs into uniform chips for paper mills. They fall under this tariff item due to their paring/chipping function on wood, producing chips through slicing action on hard wood.
8465.96.00Drum Wood Chippers
Drum-style chippers that feed wood through rotating drums to slice and produce chips for particleboard manufacturing. They fall under this tariff item as paring machines for woodworking, specifically generating wood chips from hard wood.
8465.96.00Electric 20-Ton Log Splitter
A stationary electric-powered log splitter with 20 tons of force, ideal for backyard use in splitting logs up to 20 inches long. It qualifies under this tariff item as a splitting machine for woodworking applications.
8465.96.00Gallium Arsenide Wafer Slicing Saw
A specialized slicing saw for compound semiconductors like gallium arsenide boules, maintaining crystal orientation during wafer separation. It is classified under this tariff item as a slicing machine for hard semiconductor materials, similar to hard plastics or hard rubber.
8465.96.00Hydraulic Log Splitter 22 Ton
A heavy-duty hydraulic log splitter rated at 22 tons of splitting force, designed specifically for processing logs into firewood by splitting along the grain. It falls under this tariff item as a machine tool for woodworking.
8465.96.00Kinetic Ram Log Splitter
A non-hydraulic kinetic log splitter using hammer action and spring tension to split logs up to 20 tons equivalent force without pumps. It falls under this tariff item as it performs the splitting function for woodworking.
8465.96.00Portable Forestry Chippers
Mobile chippers mounted on trailers for on-site wood chipping in logging operations. They are classified in this tariff item for their splitting/chipping role in woodworking on hard wood logs and branches.
8465.96.00Recycling Wood Chippers
Chippers for processing waste wood pallets and construction debris into recyclable chips. They fall under this tariff item as paring machines for hard wood materials in recycling applications.
8465.96.00Semiconductor Wafer Dicing Saw
A high-speed dicing saw used to singulate individual semiconductor chips from processed wafers using thin kerf blades. Although it operates on processed wafers, it is classified under this tariff item as a slicing machine for hard semiconductor materials.
8465.96.00Silicon Ingot Slicer
An automated slicer for cutting silicon ingots into wafers suitable for integrated circuit production, featuring wire saw technology. It falls under this tariff item as a slicing machine for hard semiconductor materials, similar to hard plastics or hard rubber.
8465.96.00Towable Horizontal/Vertical Log Splitter
A portable, tow-behind log splitter that operates in both horizontal and vertical positions for efficient log splitting up to 24 inches diameter. It is classified under this tariff item for log splitters used in woodworking.
8465.96.00Wafer Slicing Saw
A precision saw designed to slice thin wafers from monocrystalline semiconductor boules, such as silicon crystals produced by the Czochralski method. It is classified under this tariff item as a slicing machine for hard materials like silicon.