Semiconductor Wafer Dicing Saw
A high-speed dicing saw used to singulate individual semiconductor chips from processed wafers using thin kerf blades. Although it operates on processed wafers, it is classified under this tariff item as a slicing machine for hard semiconductor materials.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the saw is used solely or principally in the manufacture of semiconductor devices
Heading 84.86 covers semiconductor manufacturing machines, which takes precedence over 84.65.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Verify that the dicing saw is not part of a larger semiconductor manufacturing system, which could change classification
• Provide the CBSA with the machine's operational details
• Consider whether the saw is eligible for duty-free entry under trade agreements
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