Semiconductor Wafer Dicing Saw from Germany
A high-speed dicing saw used to singulate individual semiconductor chips from processed wafers using thin kerf blades. Although it operates on processed wafers, it is classified under this tariff item as a slicing machine for hard semiconductor materials.
Duty Rate — Germany → Canada
0%
Import Tips
• Verify that the dicing saw is not part of a larger semiconductor manufacturing system, which could change classification
• Provide the CBSA with the machine's operational details
• Consider whether the saw is eligible for duty-free entry under trade agreements