Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. It is classified under tariff item 8465.96.00 as a paring machine for hard materials, including semiconductor materials.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is used for manufacturing semiconductor devices
Machines for the manufacture of semiconductor devices are classified under this heading.
If the machine is used for grinding or polishing stone, ceramics, or similar materials
Grinding or polishing machines for these materials may be classified under this heading.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the machine is classified as a machine-tool for working hard materials
• Verify compliance with Canadian electrical and safety standards
• Prepare documentation on the machine's semiconductor application
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