Gallium Arsenide Wafer Slicing Saw
A specialized slicing saw for compound semiconductors like gallium arsenide boules, maintaining crystal orientation during wafer separation. It is classified under this tariff item as a slicing machine for hard semiconductor materials, similar to hard plastics or hard rubber.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | β | Free |
| π²π½Mexico | Free | β | Free |
| πΊπΈUnited States | Free | β | Free |
| π©πͺGermany | Free | β | Free |
| π―π΅Japan | Free | β | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the saw is solely or principally used in semiconductor device manufacturing
Machines for semiconductor manufacturing are classified in heading 84.86, which takes precedence.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β and can price the duty on it in the same conversation.
Import Tips & Compliance
β’ Provide evidence that the saw is for slicing, not for other processes like grinding or polishing
β’ Ensure the machine is not designed for semiconductor manufacturing, which would fall under 84.86
β’ Consult with a customs broker for accurate classification
Related Products under Tariff item 8465.96.00
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. It is classified under tariff item 8465.96.00 as a paring machine for hard materials, including semiconductor materials.
Commercial 30-Ton PTO Log Splitter
A professional-grade log splitter driven by tractor PTO with 30 tons of force for high-volume firewood production. It falls under this tariff item as a splitting machine for woodworking, specifically designed to split logs along the grain.
Crystal Boule Diameter Grinder
A crystal boule diameter grinder that grinds semiconductor crystal boules to precise diameter tolerances before slicing. This machine also creates orientation flats, which are essential for subsequent wafer processing steps.
Crystal Boule Grinder
A crystal boule grinder that grinds semiconductor crystal boules to exact diameters and creates flats indicating conductivity type and resistivity. This machine is critical for preparing boules for wafer slicing in semiconductor manufacturing.
Crystal Boule Slicing Machine
A high-precision machine that uses diamond wire or blades to slice semiconductor boules into individual wafers for device fabrication. It falls under this tariff item as a slicing machine specifically designed for hard materials like silicon, which are similar to hard plastics or hard rubber.
Crystal boule Slicing Multi-Wire Saw
A crystal boule slicing multi-wire saw uses hundreds of diamond wires to simultaneously slice an entire boule into hundreds of wafers, maximizing yield. It is classified under tariff item 8465.96.00 as a slicing machine for hard materials, including semiconductor materials.