Wafer Edge Grinding Machine from Japan
A wafer edge grinding machine that chamfers and profiles wafer edges to prevent chipping during handling and processing. This machine ensures wafer integrity before fabrication in semiconductor production lines.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the machine correctly as a machine-tool for working hard materials, and have documentation ready to show it is not semiconductor manufacturing equipment under heading 84.86
• Provide CBSA with the machine's technical specifications
• Check if the machine qualifies for duty-free treatment under a free trade agreement