Wafer Slicing Diamond Saw Blade
A specialized diamond-impregnated saw blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. This blade is a part of wafer slicing saws in semiconductor equipment of heading 84.25, ensuring minimal kerf loss. It is classified under tariff item 8431.10.00.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the blade is presented as an interchangeable tool rather than a part of a machine
Interchangeable tools for hand tools or machine-tools are classified in heading 82.02.
If the blade is specifically for machines used in the manufacture of semiconductor devices
Machines and apparatus for the manufacture of semiconductor devices are classified in heading 84.86.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the saw blade as a part of machinery of heading 84.25, not as a tool of Chapter 82, since it is a part of the slicing machine
• Provide evidence that the blade is designed solely for wafer slicing saws
• If the blade is imported with the saw, verify whether the complete machine classification applies instead
Related Products under Tariff item 8431.10.00
Boule Flattener Drive Capstan
A drive capstan for grinding flats on crystal boules to indicate conductivity type. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in semiconductor boule grinding equipment.
Boule Wafer Edge Profiling Tool
A diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. This assembly is a part of the machinery of heading 84.25, as it is used in wafer preparation equipment that performs lifting or hoisting functions. It ensures chip-free rounded edges for fab processing.
CMP Polisher Carrier Capstan
A capstan for chemical mechanical polishing carriers in wafer planarization. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstans used in CMP polishing equipment.
CMP Polisher Platen Assembly
A rotating platen that holds the polishing pad in chemical mechanical planarization (CMP) tools for wafers. This platen is a part of the machinery of heading 84.25, as it is an integral component of wafer polishers that use hoisting or lifting mechanisms. It ensures uniform pressure distribution for consistent polishing.
Crystal Boule Grinder Capstan Drum
A rotary capstan drum for crystal grinders that shape semiconductor boules to precise wafer diameters and flats indicating conductivity. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically capstan drums used in semiconductor boule grinding.
Crystal Boule Grinder Hoist Assembly
A hoist assembly integrated with crystal boule grinders to precisely shape semiconductor crystal boules to wafer diameters and add conductivity flats. This product is a part suitable for use solely or principally with machinery of heading 84.25, specifically hoists used in semiconductor manufacturing.