Wafer Slicing Diamond Saw Blade from United States
A specialized diamond-impregnated saw blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. This blade is a part of wafer slicing saws in semiconductor equipment of heading 84.25, ensuring minimal kerf loss. It is classified under tariff item 8431.10.00.
Duty Rate — United States → Canada
0%
Import Tips
• Classify the saw blade as a part of machinery of heading 84.25, not as a tool of Chapter 82, since it is a part of the slicing machine
• Provide evidence that the blade is designed solely for wafer slicing saws
• If the blade is imported with the saw, verify whether the complete machine classification applies instead