Of machinery of heading 84.25
Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines. > Other boring or sinking machinery: > Of machinery of heading 84.25
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8431.10.00
Boule Flattener Drive Capstan
A drive capstan for grinding flats on crystal boules to indicate conductivity type. This is a part of machinery of heading 84.25, specifically designed for use with crystal boule grinding equipment.
CMP Polisher Carrier Capstan
A capstan for chemical mechanical polishing carriers in wafer planarization. This is a part of machinery of heading 84.25, specifically designed for use with CMP polishing equipment.
Crystal Boule Grinder Capstan Drum
A rotary capstan drum for crystal grinders that shape semiconductor boules to precise wafer diameters and flats indicating conductivity. This is a part of machinery of heading 84.25, specifically designed for use with crystal grinding equipment.
Crystal Boule Grinder Hoist Assembly
A hoist assembly integrated with crystal boule grinders to precisely shape semiconductor crystal boules to wafer diameters and add conductivity flats. This is a part of machinery of heading 84.25, specifically designed for use with grinding equipment in semiconductor manufacturing.
Crystal Ingot Puller Counterweight Assembly
A counterweight system for stable pulling in semiconductor ingot growers. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Czochralski Crystal Puller for Wafer Production
A precision machine that pulls monocrystalline silicon boules from molten silicon using the Czochralski method, essential for semiconductor wafer manufacturing. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Czochralski Crystal Puller Mechanism
A specialized pulling mechanism used in Czochralski crystal growers for producing monocrystalline silicon boules from which semiconductor wafers are sliced. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Double-Sided Wafer Lapper Winch
A winch for simultaneous double-sided lapping of semiconductor wafers. This is a part of machinery of heading 84.25, specifically designed for use with wafer lapping equipment.
Float Zone Crystal Grower Mechanism
A specialized hoist mechanism for the float zone method to produce high-purity silicon crystals by zone melting without crucibles. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Float Zone Crystal Grower Winch Assembly
A winch assembly designed for float zone crystal growers that produce high-purity silicon rods for semiconductor wafers. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Gallium Arsenide Crystal Grinder Hoist
A specialized hoist for grinding GaAs crystal boules to precise diameters for compound semiconductor wafers. This is a part of machinery of heading 84.25, specifically designed for use with gallium arsenide crystal grinding equipment.
Precision Wafer Polisher Lift Assembly
An elevator-style lift assembly for chemical-mechanical wafer polishers ensuring surface flatness critical for semiconductor device fabrication. This is a part of machinery of heading 84.25, specifically designed for use with wafer polishing equipment.
Semiconductor Wafer Lapping Hoist
A lifting hoist for wafer lappers that achieve ultra-flat surfaces on sliced wafers within tight dimensional tolerances for fabrication. This is a part of machinery of heading 84.25, specifically designed for use with wafer lapping equipment.
Silicon Ingot Puller Control Pulley
A control pulley system for automated ingot pullers in Czochralski silicon growth, regulating pull speed and rotation. This is a part of machinery of heading 84.25, specifically designed for use in semiconductor crystal growing equipment.
Wafer Slicing Saw Pulley Drive
Pulley and drive components for high-precision diamond saws that slice monocrystalline boules into semiconductor wafers. This is a part of machinery of heading 84.25, specifically designed for use with wafer slicing saws.