PVD Cryogenic Pump Mounting Flange

A precision-machined flange connecting cryogenic pumps to PVD vacuum chambers for ultra-high vacuum maintenance. Specifically for physical vapor deposition apparatus of subheading 8543.70. Ensures contamination-free deposition environments.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7307.99.50Higher: 39.3% vs 35%

If plain pipe fittings

Basic metal flanges classify under Chapter 73 without vacuum/PVD function.

8419.90.95Higher: 39% vs 35%

If general lab vacuum parts

Laboratory apparatus parts if not electrical PVD designated.

8481.90.90Same rate: 35%

If other valves and fittings

Vacuum fittings under Chapter 84 if standalone.

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Import Tips & Compliance

CF or ISO flange standard specs required; helium leak test certs essential; link to specific PVD pump model

Related Products under HTS 8543.90.12.00

Titanium Sputtering Target for PVD Systems

A high-purity titanium disc used as the source material in physical vapor deposition (PVD) apparatus for depositing thin titanium films on substrates. It is specifically designed for magnetron sputtering modules within PVD vacuum chambers of subheading 8543.70. Classified under 8543.90.12.00 as a key consumable part essential for the thin-film deposition function of PVD equipment.

Magnetron Sputtering Cathode Assembly

An assembly containing permanent magnets, cooling channels, and mounting fixtures for holding sputtering targets in PVD systems. Essential for generating the plasma discharge in physical vapor deposition apparatus under subheading 8543.70. This part enables uniform thin-film deposition in semiconductor and optics manufacturing.

PVD Vacuum Chamber Baffle

A contoured metal shield installed inside PVD deposition chambers to control plasma distribution and prevent cross-contamination. Made from materials like stainless steel or molybdenum for high-vacuum compatibility in 8543.70 apparatus. Critical for maintaining film uniformity in physical vapor deposition processes.

RF Power Matching Network for PVD

An electronic module that automatically tunes RF power delivery to sputtering sources in PVD systems for optimal plasma ignition. Integral to the electrical control of physical vapor deposition apparatus in subheading 8543.70. Ensures efficient energy transfer in thin-film coating processes.

PVD Substrate Heater Element

A resistively heated platform that maintains substrate temperatures up to 800°C during PVD film deposition. Designed for integration into physical vapor deposition apparatus of subheading 8543.70. Essential for controlling deposition kinetics in microelectronics fabrication.

PVD Quartz Crystal Monitor Sensor

A sensor using quartz crystal microbalance to measure film thickness in real-time during PVD processes. Mounted inside deposition chambers of 8543.70 apparatus for precise process control. Vital for quality assurance in optical and semiconductor coatings.