Other
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Parts: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8419.90.95
Semiconductor Wafer Crystal Puller Parts
Replacement heating elements and temperature control modules for Czochralski crystal pullers used in growing monocrystalline silicon boules for semiconductor wafers. These parts facilitate precise temperature changes essential for crystal formation in semiconductor manufacturing. Classified under 8419.90.95 as parts of machinery for material treatment involving heating and cooling processes.
Wafer Grinding Machine Coolant Circulation Pump
Specialized pump assemblies for circulating coolant in semiconductor wafer grinders, maintaining precise temperature during crystal boule diameter grinding. Critical for thermal management in wafer preparation equipment per statistical notes. Parts of 8419 machinery involving cooling processes in semiconductor fabrication.
Float Zone Crystal Grower RF Heating Coils
Radio frequency heating coils for float zone crystal growers that melt and purify semiconductor material through localized heating zones. Essential parts for temperature-controlled processing of silicon into monocrystalline form as defined in statistical note (a)(i). Falls under 8419.90.95 for heating process machinery parts.
Semiconductor Lapping Machine Temperature Control Units
Integrated chiller/heater modules for wafer lapping equipment that maintain slurry temperature within 0.1°C tolerances during semiconductor wafer surface preparation. Directly referenced in statistical note (a)(ii)(C) as wafer grinders/lappers/polishers. Classifies as 8419.90.95 parts for temperature treatment.
Crystal Boule Grinder Spindle Heating Elements
Cartridge heaters embedded in grinding spindles for crystal grinders that preheat boules to prevent thermal shock during flat grinding operations. Specified in statistical note (a)(ii)(A) for semiconductor wafer preparation. 8419.90.95 parts enabling controlled heating.
Wafer Polishing Slurry Temperature Conditioners
Heat exchanger units conditioning chemical-mechanical polishing slurry temperature for semiconductor wafer polishers. Ensures consistent material removal rates per statistical note (a)(ii)(C). Parts of 8419 temperature treatment equipment.
Czochralski Puller Crucible Heating Windings
Induction heating windings surrounding graphite crucibles in Czochralski crystal pullers for silicon melting at 1420°C. Core temperature treatment component per statistical note (a)(i). Classifies under 8419.90.95 machinery parts.
Wafer Grinder Coolant Chiller Coils
Evaporator coils for chillers maintaining coolant at 18-22°C in semiconductor wafer grinders. Prevents thermal distortion during precision grinding per statistical note (a)(ii)(A). 8419.90.95 cooling process parts.
Float Zone Zone Refiner Temperature Sensors
Pyrometer mounting assemblies with protective sheaths for monitoring melt zone temperatures in float zone semiconductor refiners. Ensures purity through precise thermal profiling. While involving temperature measurement, classifies as integral 8419.90.95 heating process parts.
Wafer Slicing Saw Coolant Nozzle Assemblies
Precision coolant nozzle manifolds for wafer slicing saws that deliver temperature-controlled fluid during diamond blade cuts of semiconductor boules. Maintains thermal stability per statistical note (a)(ii)(B) wafer preparation equipment. Parts of 8419 cooling process machinery.