Wafer Grinding Machine Coolant Circulation Pump
Specialized pump assemblies for circulating coolant in semiconductor wafer grinders, maintaining precise temperature during crystal boule diameter grinding. Critical for thermal management in wafer preparation equipment per statistical notes. Parts of 8419 machinery involving cooling processes in semiconductor fabrication.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as standalone centrifugal pumps
General industrial pumps classified by pump type in 8413, not by end-use machinery.
If for other semiconductor manufacturing machines
Parts of machines not specifically involving temperature change processes go to 8479 residual provision.
If includes integrated temperature sensors
Instruments for measuring temperature in manufacturing processes classified in Chapter 90.
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Import Tips & Compliance
• Document compatibility with specific wafer grinder models from statistical note (a)(ii)(A) to substantiate classification
• Avoid common pitfall of declaring as general pumps (8413); specify semiconductor thermal processing application
• Maintain bills of materials showing integration with temperature-controlled grinding spindles
Related Products under HTS 8419.90.95
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Replacement heating elements and temperature control modules for Czochralski crystal pullers used in growing monocrystalline silicon boules for semiconductor wafers. These parts facilitate precise temperature changes essential for crystal formation in semiconductor manufacturing. Classified under 8419.90.95 as parts of machinery for material treatment involving heating and cooling processes.
Float Zone Crystal Grower RF Heating Coils
Radio frequency heating coils for float zone crystal growers that melt and purify semiconductor material through localized heating zones. Essential parts for temperature-controlled processing of silicon into monocrystalline form as defined in statistical note (a)(i). Falls under 8419.90.95 for heating process machinery parts.
Semiconductor Lapping Machine Temperature Control Units
Integrated chiller/heater modules for wafer lapping equipment that maintain slurry temperature within 0.1°C tolerances during semiconductor wafer surface preparation. Directly referenced in statistical note (a)(ii)(C) as wafer grinders/lappers/polishers. Classifies as 8419.90.95 parts for temperature treatment.
Crystal Boule Grinder Spindle Heating Elements
Cartridge heaters embedded in grinding spindles for crystal grinders that preheat boules to prevent thermal shock during flat grinding operations. Specified in statistical note (a)(ii)(A) for semiconductor wafer preparation. 8419.90.95 parts enabling controlled heating.
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Heat exchanger units conditioning chemical-mechanical polishing slurry temperature for semiconductor wafer polishers. Ensures consistent material removal rates per statistical note (a)(ii)(C). Parts of 8419 temperature treatment equipment.
Czochralski Puller Crucible Heating Windings
Induction heating windings surrounding graphite crucibles in Czochralski crystal pullers for silicon melting at 1420°C. Core temperature treatment component per statistical note (a)(i). Classifies under 8419.90.95 machinery parts.