CMOS Image Sensor Wafers
Complementary metal-oxide semiconductor wafers with pixel arrays for digital imaging. These unmounted photosensitive wafers under 8541.49.10.10 supply smartphone and automotive camera fabs.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If digital still image cameras
Complete camera modules including CMOS classified in 8525.
If vehicle camera assemblies
Automotive ADAS cameras shift to vehicle parts classification.
If hybrid integrated circuits
Multi-chip modules with CMOS become hybrid ICs.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Megapixel count and fill factor specs critical for classification verification
• Backside illuminated wafers require special handling declarations
• Foundry-specific markings aid traceability during CBP review
Related Products under HTS 8541.49.10.10
SWIR InGaAs Photodiode Wafers
Short-wave infrared InGaAs wafers for machine vision and spectroscopy beyond 1700nm. HTS 8541.49.10.10 covers these unmounted photosensitive semiconductor wafers for defense and industrial apps.
Silicon Photodiode Chips
Unmounted silicon chips designed as photodiodes that convert light into electrical current. These fall under HTS 8541.49.10.10 as photosensitive semiconductor devices in the form of unmounted chips used for optical sensing applications. They are raw dice ready for packaging in sensors or detectors.
GaAs Photodiode Wafers
Gallium arsenide semiconductor wafers generating photocurrent from infrared light. Classified in 8541.49.10.10 as unmounted photosensitive wafers for telecom and laser detection. These full wafers are sliced into dice post-import for device fabrication.
CCD Image Sensor Dice
Charge-coupled device (CCD) semiconductor dice for capturing visible light images. These unmounted chips under 8541.49.10.10 are photosensitive semiconductors used in scientific cameras and astronomy equipment before packaging.
InGaAs PIN Photodiode Dice
Indium gallium arsenide PIN junction dice for near-infrared fiber optic receivers. These unmounted photosensitive semiconductors under 8541.49.10.10 enable high-speed data transmission detection.
APD Avalanche Photodiode Wafers
Germanium wafers for avalanche photodiodes providing internal gain for low-light detection. Classified 8541.49.10.10 as unmounted photosensitive wafers for LIDAR and spectroscopy.