Unmounted chips, dice and wafers
Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals; parts thereof: > Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED): > Other: > Other diodes > Unmounted chips, dice and wafers
Duty Rate (from China)
Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8541.49.10.10
SWIR InGaAs Photodiode Wafers
Short-wave infrared InGaAs wafers for machine vision and spectroscopy beyond 1700nm. HTS 8541.49.10.10 covers these unmounted photosensitive semiconductor wafers for defense and industrial apps.
Silicon Photodiode Chips
Unmounted silicon chips designed as photodiodes that convert light into electrical current. These fall under HTS 8541.49.10.10 as photosensitive semiconductor devices in the form of unmounted chips used for optical sensing applications. They are raw dice ready for packaging in sensors or detectors.
GaAs Photodiode Wafers
Gallium arsenide semiconductor wafers generating photocurrent from infrared light. Classified in 8541.49.10.10 as unmounted photosensitive wafers for telecom and laser detection. These full wafers are sliced into dice post-import for device fabrication.
CCD Image Sensor Dice
Charge-coupled device (CCD) semiconductor dice for capturing visible light images. These unmounted chips under 8541.49.10.10 are photosensitive semiconductors used in scientific cameras and astronomy equipment before packaging.
InGaAs PIN Photodiode Dice
Indium gallium arsenide PIN junction dice for near-infrared fiber optic receivers. These unmounted photosensitive semiconductors under 8541.49.10.10 enable high-speed data transmission detection.
APD Avalanche Photodiode Wafers
Germanium wafers for avalanche photodiodes providing internal gain for low-light detection. Classified 8541.49.10.10 as unmounted photosensitive wafers for LIDAR and spectroscopy.
Quantum Dot Photodetector Chips
PbS quantum dot semiconductor chips tunable across SWIR spectrum for hyperspectral imaging. HTS 8541.49.10.10 applies to these emerging unmounted photosensitive dice.
Silicon PIN Photodiode Dice
Standard silicon PIN junction dice for general-purpose visible light detection in barcode scanners. Unmounted chips under 8541.49.10.10 for consumer electronics packaging.
CMOS Image Sensor Wafers
Complementary metal-oxide semiconductor wafers with pixel arrays for digital imaging. These unmounted photosensitive wafers under 8541.49.10.10 supply smartphone and automotive camera fabs.
UV Photodiode Chips
Silicon carbide unmounted chips sensitive to ultraviolet radiation for flame detection and sterilization monitoring. HTS 8541.49.10.10 covers these photosensitive diode dice used in industrial safety systems.