Semiconductor Wafer Lapping Bearing Unit
Precision housed bearing for wafer lapping/polishing machines that achieve flatness for device fabrication. Under HTS 8483.20.80 as other housed bearings per statistical note (b)(ii)(C) for wafer preparation. Critical for sub-micron surface finish.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for chemical-mechanical polishing equipment
CMP wafer polishers classified as chemical processing centrifuges.
If lapping ring housing only
Separate housings without bearings are general parts.
If lapping with profile measurement
Flatness testing integrated units become measuring instruments.
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Import Tips & Compliance
• Include lapping pressure and slurry compatibility specs in technical docs
• Class 1 cleanroom certification and particle generation data required
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