Semiconductor Wafer Lapping Bearing Unit from Mexico
Precision housed bearing for wafer lapping/polishing machines that achieve flatness for device fabrication. Under HTS 8483.20.80 as other housed bearings per statistical note (b)(ii)(C) for wafer preparation. Critical for sub-micron surface finish.
Duty Rate — Mexico → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Include lapping pressure and slurry compatibility specs in technical docs
• Class 1 cleanroom certification and particle generation data required