Semiconductor Wafer Lapping Bearing Unit from Canada
Precision housed bearing for wafer lapping/polishing machines that achieve flatness for device fabrication. Under HTS 8483.20.80 as other housed bearings per statistical note (b)(ii)(C) for wafer preparation. Critical for sub-micron surface finish.
Duty Rate — Canada → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include lapping pressure and slurry compatibility specs in technical docs
• Class 1 cleanroom certification and particle generation data required