Semiconductor Wafer Lapping Bearing Unit from Canada
Precision housed bearing for wafer lapping/polishing machines that achieve flatness for device fabrication. Under HTS 8483.20.80 as other housed bearings per statistical note (b)(ii)(C) for wafer preparation. Critical for sub-micron surface finish.
Duty Rate — Canada → United States
14.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include lapping pressure and slurry compatibility specs in technical docs
• Class 1 cleanroom certification and particle generation data required