Gallium Arsenide Wafer Polisher Race from Japan
Titanium outer race for chemically inert ball bearings polishing GaAs wafers to atomic flatness. Resists CMP slurry corrosion during 0.5μm/min removal rates. HTS 8482.99.05.00 as outer ring for ball bearings in semiconductor processing.
Duty Rate — Japan → United States
34.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify GaAs compatibility and slurry types (e.g
• colloidal ceria)
• Include titanium grade (Grade 5 ELI) and passivation details
• Import before machine integration to leverage parts rates