Gallium Arsenide Wafer Polisher Race from Japan
Titanium outer race for chemically inert ball bearings polishing GaAs wafers to atomic flatness. Resists CMP slurry corrosion during 0.5μm/min removal rates. HTS 8482.99.05.00 as outer ring for ball bearings in semiconductor processing.
Duty Rate — Japan → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify GaAs compatibility and slurry types (e.g
• colloidal ceria)
• Include titanium grade (Grade 5 ELI) and passivation details
• Import before machine integration to leverage parts rates