Gallium Arsenide Wafer Polisher Race from China
Titanium outer race for chemically inert ball bearings polishing GaAs wafers to atomic flatness. Resists CMP slurry corrosion during 0.5μm/min removal rates. HTS 8482.99.05.00 as outer ring for ball bearings in semiconductor processing.
Duty Rate — China → United States
44.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify GaAs compatibility and slurry types (e.g
• colloidal ceria)
• Include titanium grade (Grade 5 ELI) and passivation details
• Import before machine integration to leverage parts rates