Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles

Copper alloy balls engineered for non-magnetic properties in high-speed spindles of wafer grinders that process crystal boules to precise diameters for semiconductor wafers. HTS 8482.91.0015 applies per statistical note 6 for copper balls in wafer preparation equipment. Critical for maintaining crystal orientation during grinding.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8482Same rate: 39.4%

If configured as needles rather than balls

Different bearing element geometries (needles vs. balls) have separate subheadings.

8207.90.30Higher: 40% vs 39.4%

If for interchangeable tooling rather than fixed bearings

Interchangeable grinding tools classify as interchangeable parts of machines.

7415.21.00.00Lower: 38% vs 39.4%

If bulk copper alloy powder metallurgy products

Unspecified copper alloy articles from powder metallurgy fall under Chapter 74.

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Import Tips & Compliance

Certify magnetic permeability <1.005 for non-magnetic qualification

Provide equipment OEM specifications linking balls to wafer grinder models

Watch for contamination risks—require cleanroom packaging protocols

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