Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles from China
Copper alloy balls engineered for non-magnetic properties in high-speed spindles of wafer grinders that process crystal boules to precise diameters for semiconductor wafers. HTS 8482.91.0015 applies per statistical note 6 for copper balls in wafer preparation equipment. Critical for maintaining crystal orientation during grinding.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify magnetic permeability <1.005 for non-magnetic qualification
• Provide equipment OEM specifications linking balls to wafer grinder models
• Watch for contamination risks—require cleanroom packaging protocols