Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles from Japan
Copper alloy balls engineered for non-magnetic properties in high-speed spindles of wafer grinders that process crystal boules to precise diameters for semiconductor wafers. HTS 8482.91.0015 applies per statistical note 6 for copper balls in wafer preparation equipment. Critical for maintaining crystal orientation during grinding.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify magnetic permeability <1.005 for non-magnetic qualification
• Provide equipment OEM specifications linking balls to wafer grinder models
• Watch for contamination risks—require cleanroom packaging protocols