8482.91.00.15/Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles/Japan

Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles from Japan

Copper alloy balls engineered for non-magnetic properties in high-speed spindles of wafer grinders that process crystal boules to precise diameters for semiconductor wafers. HTS 8482.91.0015 applies per statistical note 6 for copper balls in wafer preparation equipment. Critical for maintaining crystal orientation during grinding.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify magnetic permeability <1.005 for non-magnetic qualification

• Provide equipment OEM specifications linking balls to wafer grinder models

• Watch for contamination risks—require cleanroom packaging protocols

Non-Magnetic Copper Roller Balls for Wafer Grinding Machine Spindles from Japan — Import Duty Rate | HTS 8482.91.00.15