Vacuum-Compatible Needle Roller Bearing
Needle roller bearing rated for ultra-high vacuum environments in semiconductor wafer lapping machines, providing high load capacity in minimal space. Falls under HTS 8482.80.00.80 as other roller bearings for precision semiconductor processing per chapter statistical notes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If standard tapered roller bearings
Tapered rollers for conical loads classify separately in 8482.20.
If sold as loose needle rollers or cages
Unassembled bearing parts shift to 8482.99 other parts.
If for complete wafer polishing machines
Finished semiconductor processing machines classify in 8479, excluding standalone bearings.
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Import Tips & Compliance
• Include vacuum rating certifications (e.g
• 10^-9 Torr) and cleanroom compatibility docs
• Detail integration into lapping/polishing apparatus to support 8482 classification over machinery headings
Related Products under HTS 8482.80.00.80
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for semiconductor wafer grinding machines, capable of handling both radial and axial loads at high speeds. It falls under HTS 8482.80.00.80 as an other ball bearing not specified elsewhere in heading 8482. This subheading covers specialized bearings used in precision machinery like semiconductor processing equipment.
Ceramic Hybrid Roller Bearing
A ceramic hybrid roller bearing used in high-speed wafer slicing saws for semiconductor manufacturing, featuring silicon nitride balls for reduced friction and heat. Classified in HTS 8482.80.00.80 as other combined or specialized roller bearings not fitting primary subheadings. Its application in precise slicing equipment aligns with statistical notes for wafer preparation.
High-Temperature Deep Groove Ball Bearing
Deep groove ball bearing with high-temperature alloys for crystal grinders in semiconductor boule preparation, enduring 500°C+ during diameter grinding. Classified HTS 8482.80.00.80 for other bearings in wafer manufacturing equipment as defined in statistical notes.
Low-Vibration Precision Roller Bearing
Low-vibration cylindrical roller bearing for float-zone crystal pullers, minimizing boule defects in monocrystalline growth. HTS 8482.80.00.80 for other rollers in semiconductor crystal growing equipment.
Monocrystalline Wafer Lapper Bearing
Angular contact bearing for wafer lappers ensuring dimensional tolerances in semiconductor fabrication prep. HTS 8482.80.00.80 for other bearings in (a)(ii)(C) lappers/polishers.
Wafer Grinder Spindle Bearing
Custom spindle bearing assembly for semiconductor crystal grinders, grinding boules to wafer diameters with flat indicators. Under HTS 8482.80.00.80 as other bearing for statistical note (a)(ii)(A) equipment.