Ceramic Hybrid Roller Bearing
A ceramic hybrid roller bearing used in high-speed wafer slicing saws for semiconductor manufacturing, featuring silicon nitride balls for reduced friction and heat. Classified in HTS 8482.80.00.80 as other combined or specialized roller bearings not fitting primary subheadings. Its application in precise slicing equipment aligns with statistical notes for wafer preparation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If standard cylindrical roller type without hybrid materials
Non-hybrid cylindrical rollers classify under 8482.50, separate from specialized ceramic hybrids.
If for spherical roller bearing variants
Spherical rollers for misalignment tolerance fall under 8482.91, differing from precision slicing applications.
If integrated into testing apparatus
Bearings in semiconductor testing machines (per statistical notes) may classify in Chapter 90 as measuring instruments.
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Import Tips & Compliance
• Provide material composition certificates (e.g
• Si3N4 ceramics) to support hybrid classification and duty assessment
• Ensure invoices specify semiconductor end-use to prevent misclassification as general industrial bearings
• Avoid pitfalls by confirming ABEC/ISO precision class; ultra-precision may trigger different subheadings
Related Products under HTS 8482.80.00.80
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for semiconductor wafer grinding machines, capable of handling both radial and axial loads at high speeds. It falls under HTS 8482.80.00.80 as an other ball bearing not specified elsewhere in heading 8482. This subheading covers specialized bearings used in precision machinery like semiconductor processing equipment.
High-Temperature Deep Groove Ball Bearing
Deep groove ball bearing with high-temperature alloys for crystal grinders in semiconductor boule preparation, enduring 500°C+ during diameter grinding. Classified HTS 8482.80.00.80 for other bearings in wafer manufacturing equipment as defined in statistical notes.
Low-Vibration Precision Roller Bearing
Low-vibration cylindrical roller bearing for float-zone crystal pullers, minimizing boule defects in monocrystalline growth. HTS 8482.80.00.80 for other rollers in semiconductor crystal growing equipment.
Monocrystalline Wafer Lapper Bearing
Angular contact bearing for wafer lappers ensuring dimensional tolerances in semiconductor fabrication prep. HTS 8482.80.00.80 for other bearings in (a)(ii)(C) lappers/polishers.
Wafer Grinder Spindle Bearing
Custom spindle bearing assembly for semiconductor crystal grinders, grinding boules to wafer diameters with flat indicators. Under HTS 8482.80.00.80 as other bearing for statistical note (a)(ii)(A) equipment.
Thin-Section Ball Bearing for Crystal Pullers
Thin-section ball bearing engineered for crystal growers and pullers in semiconductor boule production, offering minimal cross-section for compact high-purity growth chambers. It is included in HTS 8482.80.00.80 for other ball bearings suited to semiconductor material growth equipment as per statistical notes.