High-Temperature Deep Groove Ball Bearing
Deep groove ball bearing with high-temperature alloys for crystal grinders in semiconductor boule preparation, enduring 500°C+ during diameter grinding. Classified HTS 8482.80.00.80 for other bearings in wafer manufacturing equipment as defined in statistical notes.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If matched automotive-size deep groove balls
Size-specific deep groove (e.g., <52mm) go to 8482.10 subheadings.
If pulley-integrated for grinder drives
Bearing-mounted pulleys classify as flywheels/pulleys in 8483.50.
If part of non-electrical semiconductor testing gear
Per notes, testing apparatus bearings may enter Chapter 90.
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Import Tips & Compliance
• Certify temperature ratings and material (e.g
• Inconel) for grinder applications
• Use HTS advisory rulings for high-temp variants to preempt CBP challenges
• Avoid bulk packaging misread as parts; ship as complete assemblies
Related Products under HTS 8482.80.00.80
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for semiconductor wafer grinding machines, capable of handling both radial and axial loads at high speeds. It falls under HTS 8482.80.00.80 as an other ball bearing not specified elsewhere in heading 8482. This subheading covers specialized bearings used in precision machinery like semiconductor processing equipment.
Ceramic Hybrid Roller Bearing
A ceramic hybrid roller bearing used in high-speed wafer slicing saws for semiconductor manufacturing, featuring silicon nitride balls for reduced friction and heat. Classified in HTS 8482.80.00.80 as other combined or specialized roller bearings not fitting primary subheadings. Its application in precise slicing equipment aligns with statistical notes for wafer preparation.
Low-Vibration Precision Roller Bearing
Low-vibration cylindrical roller bearing for float-zone crystal pullers, minimizing boule defects in monocrystalline growth. HTS 8482.80.00.80 for other rollers in semiconductor crystal growing equipment.
Monocrystalline Wafer Lapper Bearing
Angular contact bearing for wafer lappers ensuring dimensional tolerances in semiconductor fabrication prep. HTS 8482.80.00.80 for other bearings in (a)(ii)(C) lappers/polishers.
Wafer Grinder Spindle Bearing
Custom spindle bearing assembly for semiconductor crystal grinders, grinding boules to wafer diameters with flat indicators. Under HTS 8482.80.00.80 as other bearing for statistical note (a)(ii)(A) equipment.
Thin-Section Ball Bearing for Crystal Pullers
Thin-section ball bearing engineered for crystal growers and pullers in semiconductor boule production, offering minimal cross-section for compact high-purity growth chambers. It is included in HTS 8482.80.00.80 for other ball bearings suited to semiconductor material growth equipment as per statistical notes.