High-Speed Radial Ball Bearing for Wafer Slicing Saws
Radial ball bearing engineered for high RPM diamond wafer slicing saws that cut monocrystalline boules into thin wafers. Under HTS 8482.10.5064 as other radial bearings. Ceramic hybrid construction reduces heat and particles during continuous operation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integral to slicing saw head assembly
When inseparable from semiconductor-specific slicing machine, classifies as machine part.
If for transmission crankshaft use in saw drive systems
Crankshaft bearings separate under specific transmission machinery provisions.
If bearing includes wafer thickness measuring functionality
Integrated measuring devices for process control move to Chapter 90 instruments.
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Import Tips & Compliance
• Include test data showing <0.1µm particle generation for fab cleanroom acceptance
• Declare dynamic load ratings explicitly to prevent undervaluation disputes
• Bundle with saw spindle blueprints if imported as calibrated assembly component
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