High-Speed Radial Ball Bearing for Wafer Slicing Saws from Japan
Radial ball bearing engineered for high RPM diamond wafer slicing saws that cut monocrystalline boules into thin wafers. Under HTS 8482.10.5064 as other radial bearings. Ceramic hybrid construction reduces heat and particles during continuous operation.
Duty Rate — Japan → United States
19%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include test data showing <0.1µm particle generation for fab cleanroom acceptance
• Declare dynamic load ratings explicitly to prevent undervaluation disputes
• Bundle with saw spindle blueprints if imported as calibrated assembly component