Rough Chrome Steel Radial Ball Bearings for Wafer Slicing Saws
Unground chrome steel radial ball bearings support the high-speed spindle in wafer slicing saws that cut monocrystalline boules into semiconductor wafers. Classified under HTS 8482.10.50.04 due to their unfinished, unground state before final machining. These bearings enable precise slicing essential for semiconductor wafer preparation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as integral parts of wafer slicing saw machines
Bearings permanently incorporated into slicing saws classify as parts of tool machinery under 8466.
If sold as complete bearing assemblies with races and retainers
Assembled bearing units with multiple components shift from individual unground bearings to 8482.91.
If primarily of stainless steel composition over 65%
High stainless content may trigger material-based classification under iron/steel articles before bearing heading.
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Import Tips & Compliance
• Provide engineering drawings showing unground tolerances to distinguish from finished bearings under 8482.10.50.40
• Include end-use statements linking bearings to wafer slicing equipment per statistical notes for proper Chapter 84 treatment
• Avoid misclassification as semiconductor testing parts (9031) by documenting fabrication process application
Related Products under HTS 8482.10.50.04
Preliminary Silicon Nitride Ball Bearings for Wafer Polishers
Unground ceramic silicon nitride ball bearings for wafer polishers that achieve mirror finishes on semiconductor wafers before fabrication. Classified as unground bearings under HTS 8482.10.50.04 despite advanced material, due to unfinished surface processing. Enable contamination-free polishing critical for device yield.
Unground Steel Ball Bearings for Wafer Crystal Pullers
These unground steel ball bearings are preliminary components used in the rotating mechanisms of Czochralski crystal pullers for growing monocrystalline silicon boules in semiconductor manufacturing. They fall under HTS 8482.10.50.04 as unground ball bearings, which are unfinished and require further grinding before final use. Their rough surface finish distinguishes them from polished bearings in other subheadings.
Unground Angular Contact Ball Bearings for Wafer Grinders
These unground angular contact ball bearings handle axial and radial loads in wafer grinders that shape crystal boules to precise diameters for semiconductor wafer production. HTS 8482.10.50.04 applies to their unfinished surface condition prior to final polishing. Critical for achieving flatness tolerances in wafer preparation equipment.
Rough Deep Groove Ball Bearings for Float Zone Crystal Growers
Unground deep groove ball bearings supporting RF coils in float zone crystal growers for high-purity silicon production in semiconductors. HTS 8482.10.50.04 covers their preliminary machined state before grinding. Essential for vibration-free zone refining process per statistical notes.