Rough Chrome Steel Radial Ball Bearings for Wafer Slicing Saws from China
Unground chrome steel radial ball bearings support the high-speed spindle in wafer slicing saws that cut monocrystalline boules into semiconductor wafers. Classified under HTS 8482.10.50.04 due to their unfinished, unground state before final machining. These bearings enable precise slicing essential for semiconductor wafer preparation.
Duty Rate — China → United States
44%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide engineering drawings showing unground tolerances to distinguish from finished bearings under 8482.10.50.40
• Include end-use statements linking bearings to wafer slicing equipment per statistical notes for proper Chapter 84 treatment
• Avoid misclassification as semiconductor testing parts (9031) by documenting fabrication process application