Proportional Hydraulic Pressure Control Valve for Wafer Slicing Saws from Germany
Proportional hydraulic valve that precisely reduces and maintains blade coolant pressure in wafer slicing saws cutting monocrystalline semiconductor boules into wafers. HTS 8481.10.0020 classification for hydraulic fluid power pressure-reducing valves used in wafer preparation equipment. Ensures consistent slicing pressure for uniform wafer thickness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include saw blade pressure specifications matching valve output range in import documentation,Certify valve materials for deionized water coolant compatibility used in wafer slicing,Maintain records showing integration with inner diameter (ID) slicing saws for statistical note compliance