Proportional Hydraulic Pressure Control Valve for Wafer Slicing Saws
Proportional hydraulic valve that precisely reduces and maintains blade coolant pressure in wafer slicing saws cutting monocrystalline semiconductor boules into wafers. HTS 8481.10.0020 classification for hydraulic fluid power pressure-reducing valves used in wafer preparation equipment. Ensures consistent slicing pressure for uniform wafer thickness.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as part of complete wafer slicing machine
Parts of semiconductor wafer preparation machines classify under machine parts provisions
If non-fluid power hydraulic design
Hydraulic valves not meeting fluid power specifications classify under other pressure-reducing valves
If with integrated electronic pressure measurement
Measuring and controlling valves with instruments classify in Chapter 90
Not sure which classification is right?
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Import Tips & Compliance
• Include saw blade pressure specifications matching valve output range in import documentation,Certify valve materials for deionized water coolant compatibility used in wafer slicing,Maintain records showing integration with inner diameter (ID) slicing saws for statistical note compliance
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