Hydraulic fluid power type
Taps, cocks, valves and similar appliances, for pipes, boiler shells, tanks, vats or the like, including pressure-reducing valves and thermostatically controlled valves; parts thereof: > Pressure-reducing valves > Hydraulic fluid power type
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8481.10.00.20
Hydraulic Pressure Reducing Valve for Semiconductor Wafer Crystal Pullers
This hydraulic pressure reducing valve regulates fluid pressure in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8481.10.0020 as a hydraulic fluid power type pressure-reducing valve essential for precise control in semiconductor manufacturing equipment. The valve maintains stable hydraulic pressure during the crystal growth process to ensure boule uniformity.
Hydraulic Sequence Valve for Float Zone Wafer Crystal Growth Systems
Hydraulic sequence valve that controls pressure staging in float zone crystal growers for producing high-purity silicon crystals used in semiconductor wafers. Classified under HTS 8481.10.0020 as hydraulic pressure-reducing type for precise fluid power control. Critical for maintaining zone stability during monocrystalline semiconductor material processing.
Proportional Hydraulic Pressure Control Valve for Wafer Slicing Saws
Proportional hydraulic valve that precisely reduces and maintains blade coolant pressure in wafer slicing saws cutting monocrystalline semiconductor boules into wafers. HTS 8481.10.0020 classification for hydraulic fluid power pressure-reducing valves used in wafer preparation equipment. Ensures consistent slicing pressure for uniform wafer thickness.
Hydraulic Back Pressure Regulator for Crystal Boule Grinders
Back pressure hydraulic regulator maintaining consistent grinding force on semiconductor crystal boules during diameter precision grinding for wafer production. Classifies under HTS 8481.10.0020 as hydraulic fluid power pressure-reducing valve for wafer manufacturing equipment. Critical for achieving required boule diameter tolerances.
Servo-Controlled Hydraulic Pressure Reducing Valve for Wafer Lappers
Servo-controlled hydraulic valve precisely regulating lapping pressure on semiconductor wafers to achieve critical flatness specifications before fabrication. HTS 8481.10.0020 for hydraulic fluid power pressure-reducing valves in wafer preparation equipment. Essential for maintaining wafer surface flatness tolerances.
Hydraulic Relief Pressure Valve for Wafer Polishing Equipment
Hydraulic relief valve reducing pressure in polishing head hydraulic systems for final semiconductor wafer surface preparation. Classified HTS 8481.10.0020 as hydraulic fluid power pressure-reducing valve per statistical notes for wafer polishers. Maintains precise polishing pressure for mirror surface finish.
Hydraulic Pilot-Operated Pressure Reducing Valve for Crystal Puller Chambers
Pilot-operated hydraulic valve controlling chamber pressure in Czochralski crystal pullers for semiconductor boule growth. HTS 8481.10.0020 classification for hydraulic fluid power pressure-reducing valves in wafer manufacturing equipment. Provides stable pressure reference for crystal growth process control.
Hydraulic Counterbalance Valve for Wafer Grinder Spindle Systems
Counterbalance hydraulic valve maintaining stable spindle downforce in wafer grinders processing semiconductor wafers to precise thickness. Classifies under HTS 8481.10.0020 as hydraulic pressure-reducing valve for wafer preparation equipment. Prevents spindle bounce during high-precision grinding operations.